Quality Control All components
01
Incoming inspection : Schedule Order
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Comparing with digital photo database.
Labels identification
Bar-code reading
Data codes identification
Risk Assemssement : co planarity, ESD, MSL
X-ray semiconductor inspection
02
Without packing removal
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Visual inspection on 20 components according to
packing factorsMicroscope inspection
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Microscope
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Vacuum Seal Machine
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X-ray semiconductor inspection
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Constant Temp &
Humidity Chamber
03
RMA Analysis
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Decapsulation
X-ray
Optical Inspection
Electrical bench test
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Blacktop (Scrape)
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X-ray
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Optical Inspection
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Electrical bench test